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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
HSB16-404018

HSB16-404018

HEAT SINK, BGA, 40 X 40 X 18 MM

CUI Devices

1,262 2.23
- +

RFQ

HSB16-404018

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 1.575 (40.00mm) 1.575 (40.00mm) - 0.709 (18.00mm) 9.4W @ 75°C 2.60°C/W @ 200 LFM 7.96°C/W Aluminum Alloy
647-10ABEP

647-10ABEP

HEATSINK TO-220 W/PINS BLK 1

Wakefield-Vette

5,312 1.82
- +

RFQ

647-10ABEP

Datasheet

Bulk 647 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.650 (41.91mm) 1.000 (25.40mm) - 1.000 (25.40mm) 6.0W @ 42°C 3.80°C/W @ 200 LFM - Aluminum
DA-T268-301E-TR

DA-T268-301E-TR

HEATSINK FOR TO-268

Ohmite

6,858 2.67
- +

RFQ

DA-T268-301E-TR

Datasheet

Tape & Reel (TR),Cut Tape (CT) D Active Top Mount Solderable Feet Rectangular, Fins 0.500 (12.70mm) 1.580 (40.13mm) - 0.460 (11.68mm) 7.0W @ 35°C 4.00°C/W @ 700 LFM - Aluminum
580100B00000G

580100B00000G

HEATSINK SLIDE-ON 8-DIP

Aavid, Thermal Division of Boyd Corporation

1,001 2.25
- +

RFQ

580100B00000G

Datasheet

Bulk - Active Top Mount Press Fit, Slide On Rectangular, Fins 0.562 (14.27mm) 0.600 (15.24mm) - 0.450 (11.43mm) 1.0W @ 30°C 8.00°C/W @ 500 LFM 30.00°C/W Aluminum
EA-T220-38E

EA-T220-38E

HEATSINK FOR TO-220 BLACK

Ohmite

2,082 2.26
- +

RFQ

EA-T220-38E

Datasheet

Box E Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.500 (38.10mm) 1.378 (35.00mm) - 0.500 (12.70mm) 8.0W @ 80°C 4.00°C/W @ 300 LFM 10.40°C/W Aluminum
WV-T220-101E

WV-T220-101E

HEATSINK AND CLIP FOR TO-220

Ohmite

426 2.26
- +

RFQ

WV-T220-101E

Datasheet

Tray W Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.201 (30.50mm) 0.720 (18.29mm) - 0.630 (16.00mm) 1.0W @ 20°C - 13.00°C/W Aluminum
322605B00000G

322605B00000G

HEATSINK TO-5 1.25W H=.25 BLK

Aavid, Thermal Division of Boyd Corporation

1,076 2.31
- +

RFQ

322605B00000G

Datasheet

Bag - Active Top Mount Press Fit Cylindrical - - 0.315 (8.00mm) ID, 0.750 (19.05mm) OD 0.250 (6.35mm) 1.0W @ 60°C 25.00°C/W @ 200 LFM 54.00°C/W Aluminum
E2A-T247-38E

E2A-T247-38E

BLACK ANODIZED HEATSINK

Ohmite

1,966 2.32
- +

RFQ

E2A-T247-38E

Datasheet

Box EX Active Board Level, Vertical Bolt On and Board Mounts Rectangular, Fins 0.641 (16.28mm) 0.642 (16.30mm) - 1.500 (38.10mm) 4.0W @ 70°C 4.00°C/W @ 300 LFM 14.00°C/W Aluminum
530613B00000G

530613B00000G

HEATSINK TO-220 BLACK 1.18

Aavid, Thermal Division of Boyd Corporation

1,115 2.32
- +

RFQ

530613B00000G

Datasheet

Bag - Active Board Level Bolt On Rectangular, Fins 1.180 (29.97mm) 1.000 (25.40mm) - 0.500 (12.70mm) 4.0W @ 80°C 6.00°C/W @ 600 LFM 16.70°C/W Aluminum
658-35ABT4E

658-35ABT4E

HEATSINK CPU 28MM SQ BLK W/TAPE

Wakefield-Vette

2,454 2.36
- +

RFQ

658-35ABT4E

Datasheet

Bulk 658 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.100 (27.94mm) 1.100 (27.94mm) - 0.350 (8.89mm) - 3.00°C/W @ 800 LFM - Aluminum
577202B04000G

577202B04000G

HEATSINK TO-220 .500 COMPACT

Aavid, Thermal Division of Boyd Corporation

449 2.36
- +

RFQ

577202B04000G

Datasheet

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.750 (19.05mm) 0.520 (13.21mm) - 0.500 (12.70mm) 1.5W @ 40°C 10.00°C/W @ 200 LFM 24.40°C/W Aluminum
V2032B

V2032B

HEATSINK CPU FORGED

Assmann WSW Components

1,383 2.44
- +

RFQ

V2032B

Datasheet

Bulk - Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.728 (18.50mm) - - 5.00°C/W Aluminum Alloy
573400D00010G

573400D00010G

HEATSINK D-PAK3 TIN PLATED SMD

Aavid, Thermal Division of Boyd Corporation

6,592 3.12
- +

RFQ

573400D00010G

Datasheet

Tape & Reel (TR),Cut Tape (CT) - Active Top Mount SMD Pad Rectangular, Fins 0.500 (12.70mm) 1.220 (30.99mm) - 0.401 (10.20mm) 1.0W @ 20°C 4.00°C/W @ 600 LFM 14.00°C/W Copper
FIT0818

FIT0818

BLACK ALUMINUM HEATSINKKIT FOR R

DFRobot

467 2.50
- +

RFQ

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Rectangular, Pin Fins - - - - - - - Aluminum
658-45ABT3

658-45ABT3

HEATSINK CPU 28MM SQ BLK W/TAPE

Wakefield-Vette

31,738 2.51
- +

RFQ

658-45ABT3

Datasheet

Bulk 658 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.100 (27.94mm) 1.100 (27.94mm) - 0.450 (11.43mm) 3.0W @ 50°C 6.00°C/W @ 200 LFM - Aluminum
M48079B011000G

M48079B011000G

MAX CLIP HEATSINK

Aavid, Thermal Division of Boyd Corporation

143 2.51
- +

RFQ

M48079B011000G

Datasheet

Bulk Max Clip System™ Active Board Level, Vertical Clip and PC Pin Rectangular, Angled Fins 0.790 (20.07mm) 0.866 (22.00mm) - 1.516 (38.50mm) - - - Aluminum
HSB17-404025

HSB17-404025

HEAT SINK, BGA, 40 X 40 X 25 MM

CUI Devices

180 2.53
- +

RFQ

HSB17-404025

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 1.575 (40.00mm) 1.575 (40.00mm) - 0.984 (25.00mm) 11.7W @ 75°C 2.10°C/W @ 200 LFM 6.41°C/W Aluminum Alloy
374324B00035G

374324B00035G

HEATSINK BGA W/ADHESIVE TAPE

Aavid, Thermal Division of Boyd Corporation

2,754 2.54
- +

RFQ

374324B00035G

Datasheet

Box 37432 Active Board Level Thermal Tape, Adhesive (Included) Square, Pin Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.394 (10.00mm) 3.0W @ 90°C 9.30°C/W @ 200 LFM 30.60°C/W Aluminum
573300D00000G

573300D00000G

TOP MOUNT HEATSINK .4 D2PAK

Aavid, Thermal Division of Boyd Corporation

2,509 2.58
- +

RFQ

573300D00000G

Datasheet

Bulk - Active Top Mount SMD Pad Rectangular, Fins 0.500 (12.70mm) 1.030 (26.16mm) - 0.400 (10.16mm) 1.3W @ 30°C 8.00°C/W @ 300 LFM 18.00°C/W Aluminum
501100B00000G

501100B00000G

HEATSINK 14-DIP/16-DIP

Aavid, Thermal Division of Boyd Corporation

1,292 2.60
- +

RFQ

501100B00000G

Datasheet

Bulk - Active Top Mount Thermal Tape, Adhesive (Not Included) Rectangular, Fins 0.750 (19.05mm) 0.250 (6.35mm) - 0.190 (4.83mm) 0.4W @ 30°C 30.00°C/W @ 500 LFM 67.00°C/W Aluminum
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