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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
HSB18-232310

HSB18-232310

HEAT SINK, BGA, 23 X 23 X 10 MM

CUI Devices

5,594 1.04
- +

RFQ

HSB18-232310

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 0.906 (23.00mm) 0.906 (23.00mm) - 0.394 (10.00mm) 3.7W @ 75°C 6.80°C/W @ 200 LFM 20.41°C/W Aluminum Alloy
V2029B

V2029B

HEATSINK CPU XCUT

Assmann WSW Components

1,987 1.04
- +

RFQ

V2029B

Datasheet

Tray - Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.209 (30.70mm) 1.209 (30.70mm) - 0.555 (14.10mm) - - 16.00°C/W Aluminum Alloy
V2269E1

V2269E1

CPU HEATSINK, CROSS CUT, AL6063

Assmann WSW Components

1,223 1223.00
- +

RFQ

V2269E1

Datasheet

Bulk - Active - Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.787 (20.00mm) 0.787 (20.00mm) - 0.354 (9.00mm) - - 27.00°C/W
HSE-B20254-035H

HSE-B20254-035H

HEAT SINK, EXTRUSION, TO-220,25.

CUI Devices

1,455 0.90
- +

RFQ

HSE-B20254-035H

Datasheet

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 1.000 (25.40mm) 1.375 (34.93mm) - 0.500 (12.70mm) 5.8W @ 75°C 3.28°C/W @ 200 LFM 12.93°C/W Aluminum Alloy
508500B00000G

508500B00000G

HEATSINK 24-PIN DIP GLUE-ON BLK

Aavid, Thermal Division of Boyd Corporation

9,662 1.06
- +

RFQ

508500B00000G

Datasheet

Bag - Active Top Mount Thermal Tape, Adhesive (Not Included) Rectangular, Fins 1.250 (31.75mm) 0.530 (13.46mm) - 0.190 (4.83mm) 1.0W @ 40°C 15.00°C/W @ 500 LFM 34.00°C/W Aluminum
576802B00000G

576802B00000G

HEATSINK TO-220 5W BLK

Aavid, Thermal Division of Boyd Corporation

4,814 1.07
- +

RFQ

576802B00000G

Datasheet

Bag - Active Board Level Clip Rectangular, Fins 0.750 (19.05mm) 0.500 (12.70mm) - 0.500 (12.70mm) 1.5W @ 40°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum
HSE-B250-04H

HSE-B250-04H

HEAT SINK, EXTRUSION, TO-220, 25

CUI Devices

2,558 1.07
- +

RFQ

HSE-B250-04H

Datasheet

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.984 (25.00mm) 1.378 (35.00mm) - 1.000 (25.40mm) 8.0W @ 75°C 3.26°C/W @ 200 LFM 13.60°C/W Aluminum Alloy
V7466Y

V7466Y

HEATSINK ALUM ANOD

Assmann WSW Components

2,174 1.07
- +

RFQ

V7466Y

Datasheet

Tray - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 2.000 (50.80mm) 1.772 (45.00mm) - 0.500 (12.70mm) - - 6.20°C/W Aluminum
542502D00000G

542502D00000G

HEATSINK TO-220 TAB TIN

Aavid, Thermal Division of Boyd Corporation

5,803 1.08
- +

RFQ

542502D00000G

Datasheet

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.250 (31.75mm) 0.875 (22.22mm) - 0.250 (6.35mm) 2.5W @ 60°C 4.00°C/W @ 700 LFM 24.00°C/W Aluminum
HSS03-B20-P318

HSS03-B20-P318

HEAT SINK, STAMPING, TO-220, 41.

CUI Devices

1,944 1.15
- +

RFQ

HSS03-B20-P318

Datasheet

Box HSS Active Board Level, Vertical Bolt On and PC Pin Rectangular 1.640 (41.66mm) 1.300 (33.02mm) - 0.470 (11.94mm) 5.5W @ 75°C 5.60°C/W @ 200 LFM 13.67°C/W Aluminum Alloy
575102B00000G

575102B00000G

HEATSINK TO-220 CLIP-ON BLK

Aavid, Thermal Division of Boyd Corporation

1,795 1.17
- +

RFQ

575102B00000G

Datasheet

Bag - Active Board Level Clip Rectangular, Fins 0.750 (19.05mm) 1.120 (28.45mm) - 0.440 (11.18mm) 1.0W @ 20°C 6.00°C/W @ 400 LFM 16.80°C/W Aluminum
577002B04000G

577002B04000G

HEATSINK TO-220 W/TAB .25

Aavid, Thermal Division of Boyd Corporation

1,964 1.18
- +

RFQ

577002B04000G

Datasheet

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.750 (19.05mm) 0.520 (13.21mm) - 0.250 (6.35mm) 1.5W @ 50°C 16.00°C/W @ 200 LFM 32.00°C/W Aluminum
651-B

651-B

HEATSINK 14-16PIN DIP BLK

Wakefield-Vette

1,856 1.21
- +

RFQ

651-B

Datasheet

Bulk 651 Active Top Mount Thermal Tape, Adhesive (Not Included) Rectangular, Fins 0.750 (19.05mm) 0.415 (10.54mm) - 0.240 (6.10mm) 0.5W @ 40°C 40.00°C/W @ 300 LFM - Aluminum
PB1-36CB

PB1-36CB

HEATSINK VERT .50H BLK TO-220

CTS Thermal Management Products

4,831 1.24
- +

RFQ

PB1-36CB

Datasheet

Box PB1-36 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.180 (29.97mm) 1.000 (25.40mm) - 0.500 (12.70mm) 1.0W @ 70°C - 20.00°C/W Aluminum
576602B00000G

576602B00000G

HEATSINK TO-220 VERT MNT .95

Aavid, Thermal Division of Boyd Corporation

16,213 1.25
- +

RFQ

576602B00000G

Datasheet

Bag - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.950 (24.13mm) 1.000 (25.40mm) - 0.500 (12.70mm) 1.0W @ 20°C 9.00°C/W @ 200 LFM 16.60°C/W Aluminum
ATS-PCB1029

ATS-PCB1029

HEATSINK TO-220 BLACK

Advanced Thermal Solutions Inc.

6,475 1.25
- +

RFQ

ATS-PCB1029

Datasheet

Bulk - Active Board Level Bolt On Rectangular, Fins 1.000 (25.40mm) 1.551 (39.40mm) - 0.374 (9.50mm) - 6.80°C/W @ 200 LFM 11.00°C/W Aluminum
HSB11-252518

HSB11-252518

HEAT SINK, BGA, 25 X 25 X 18 MM

CUI Devices

1,506 1.28
- +

RFQ

HSB11-252518

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.709 (18.00mm) 5.5W @ 75°C 4.50°C/W @ 200 LFM 13.70°C/W Aluminum Alloy
658-60AB

658-60AB

HEATSINK CPU 28MM SQ BLK W/OTAPE

Wakefield-Vette

6,367 1.29
- +

RFQ

658-60AB

Datasheet

Bulk 658 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100 (27.94mm) 1.100 (27.94mm) - 0.598 (15.20mm) 2.5W @ 30°C 2.00°C/W @ 500 LFM - Aluminum
V5619B

V5619B

HEATSINK ALUM ANOD

Assmann WSW Components

1,439 1.35
- +

RFQ

V5619B

Datasheet

Bulk - Active Top Mount Press Fit Rectangular, Fins 1.299 (32.99mm) 0.748 (19.00mm) - 0.189 (4.80mm) - - 48.00°C/W Aluminum
V-1102-SMD/A-L

V-1102-SMD/A-L

HEATSINK TO-263 19.38X25.40MM

Assmann WSW Components

12,800 1.36
- +

RFQ

V-1102-SMD/A-L

Datasheet

Bulk - Active Top Mount SMD Pad Rectangular, Fins 0.763 (19.38mm) 1.000 (25.40mm) - 0.450 (11.43mm) - 23.00°C/W @ 300 LFM 11.00°C/W Copper
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