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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-93-424-61-001000

116-93-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,073 23.94
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-624-61-001000

116-93-624-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,642 23.94
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
614-87-225-17-061112

614-87-225-17-061112

CONN SOCKET PGA 225POS GOLD

Preci-Dip

2,992 22.51
- +

RFQ

614-87-225-17-061112

Datasheet

Bulk 614 Active PGA 225 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
30-6503-21

30-6503-21

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,033 23.96
- +

RFQ

30-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-6503-31

30-6503-31

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,191 23.96
- +

RFQ

30-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
117-43-642-61-005000

117-43-642-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,856 23.98
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
117-93-642-61-005000

117-93-642-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,707 23.98
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
48-6823-90

48-6823-90

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2,968 23.99
- +

RFQ

48-6823-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
28-0511-11

28-0511-11

CONN SOCKET SIP 28POS GOLD

Aries Electronics

3,719 24.01
- +

RFQ

28-0511-11

Datasheet

Bulk 511 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-C182-20

32-C182-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,690 24.01
- +

RFQ

32-C182-20

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C182-30

32-C182-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,295 24.01
- +

RFQ

32-C182-30

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C212-20

32-C212-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,403 24.01
- +

RFQ

32-C212-20

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C212-30

32-C212-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,132 24.01
- +

RFQ

32-C212-30

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C300-20

32-C300-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,448 24.01
- +

RFQ

32-C300-20

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C300-30

32-C300-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,846 24.01
- +

RFQ

32-C300-30

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-43-328-61-008000

116-43-328-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,885 24.03
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-43-428-61-008000

116-43-428-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,885 24.03
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-43-628-61-008000

116-43-628-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,773 24.03
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-328-61-008000

116-93-328-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,210 24.03
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-428-61-008000

116-93-428-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,731 24.03
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
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