Sockets for ICs, Transistors - Zhuoliou industry co.,ltd

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
48-6571-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	2,140	23.92	- + RFQ	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-6572-10 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	3,297	23.92	- + RFQ	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-6573-10 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	2,065	23.92	- + RFQ	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-6575-10 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	2,436	23.92	- + RFQ	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-6574-10 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics	3,985	23.92	- + RFQ	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-3574-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	2,616	23.92	- + RFQ	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
48-6570-10 CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics	3,124	23.92	- + RFQ	Datasheet	Bulk	57	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	48 (2 x 24)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
110-43-950-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,774	23.93	- + RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-93-950-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,497	23.93	- + RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
APA-628-G-Q ADAPTER PLUG Samtec Inc.	2,162	23.93	- + RFQ		Tube	APA	Active	-	28 (2 x 14)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
510-91-073-11-042001 SOCKET SOLDERTAIL 73-PGA Mill-Max Manufacturing Corp.	2,321	23.93	- + RFQ		Bulk	510	Active	PGA	73 (11 x 11)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-073-11-061001 SOCKET SOLDERTAIL 73-PGA Mill-Max Manufacturing Corp.	3,119	23.93	- + RFQ		Bulk	510	Active	PGA	73 (11 x 11)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-073-11-042002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2,634	23.93	- + RFQ	Datasheet	Bulk	510	Active	PGA	73 (11 x 11)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-073-11-042003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,809	23.93	- + RFQ	Datasheet	Bulk	510	Active	PGA	73 (11 x 11)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-073-11-061002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,145	23.93	- + RFQ	Datasheet	Bulk	510	Active	PGA	73 (11 x 11)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-073-11-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2,299	23.93	- + RFQ	Datasheet	Bulk	510	Active	PGA	73 (11 x 11)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-324-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,059	23.94	- + RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-43-424-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,400	23.94	- + RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-43-624-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,821	23.94	- + RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-324-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,907	23.94	- + RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-