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Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
211-1-06-003 CONN IC DIP SOCKET 6POS GOLD CNC Tech	8,006	0.71	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)
211-1-08-003 CONN IC DIP SOCKET 8POS GOLD CNC Tech	5,796	0.79	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)
DILB24P-224TLF CONN IC DIP SOCKET 24POS TINLEAD Amphenol ICC (FCI)	10,853	0.85	- + RFQ	Datasheet	Tube	DILB	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon
211-1-14-003 CONN IC DIP SOCKET 14POS GOLD CNC Tech	2,554	0.97	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)
D01-9970742 CONN SOCKET SIP 7POS GOLD Harwin Inc.	4,797	0.98	- + RFQ	Datasheet	Tube	D01-997	Active	SIP	7 (1 x 7)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D01-9971242 CONN SOCKET SIP 12POS GOLD Harwin Inc.	4,700	1.08	- + RFQ	Datasheet	Tube	D01-997	Active	SIP	12 (1 x 12)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
211-1-16-003 CONN IC DIP SOCKET 16POS GOLD CNC Tech	2,759	1.23	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)
211-1-18-003 CONN IC DIP SOCKET 18POS GOLD CNC Tech	2,790	1.36	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)
ICA-308-STT CONN IC DIP SOCKET 8POS TIN Samtec Inc.	3,040	1.50	- + RFQ	Datasheet	Tube	ICA	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
211-1-20-003 CONN IC DIP SOCKET 20POS GOLD CNC Tech	1,281	1.53	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)
1050281001 CONN CAM SOCKET 32POS GOLD Molex	21,667	2.25	- + RFQ	Datasheet	Tape & Reel (TR),Cut Tape (CT)	105028	Active	Camera Socket	32 (4 x 8)	0.035 (0.90mm)	Gold	12.0µin (0.30µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.035 (0.90mm)	Nickel	50.0µin (1.27µm)	Copper Alloy	Thermoplastic
211-1-24-006 CONN IC DIP SOCKET 24POS GOLD CNC Tech	1,307	1.66	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)
211-1-28-006 CONN IC DIP SOCKET 28POS GOLD CNC Tech	1,315	1.83	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)
NTE435K64 SOCKET-64 PIN DIP .070 NTE Electronics, Inc	296	1.93	- + RFQ	Datasheet	Bulk	-	Active	DIP, 0.6 (15.24mm) Row Spacing	64 (2 x 32)	-	-	-	-	Through Hole	-	Solder	0.070 (1.78mm)	-	-	-	-
ICA-318-STT CONN IC DIP SOCKET 18POS TIN Samtec Inc.	1,054	2.59	- + RFQ	Datasheet	Tube	ICA	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
NTE419 SOCKET-3-PIN TO-5 NTE Electronics, Inc	600	2.88	- + RFQ	Datasheet	Bulk	-	Active	Transistor, TO-5 and TO-39	3 (Round)	-	-	-	-	Through Hole	-	Solder	-	-	-	-	-
NTE209 SOCKET TO-3 PWR NTE Electronics, Inc	267	3.28	- + RFQ	Datasheet	Bulk	-	Active	Transistor, TO-3	2 (1 x 2)	-	-	-	-	Through Hole	-	-	-	-	-	-	-
NTE435K52 SOCKET-52 PIN DIP .070 NTE Electronics, Inc	1,116	3.43	- + RFQ	Datasheet	Bulk	-	Active	DIP, 0.698 (17.72mm) Row Spacing	52 (2 x 26)	-	-	-	-	Through Hole	-	Solder	0.070 (1.78mm)	-	-	-	-
ICF-328-T-O-TR .100 SURFACE MOUNT SCREW MACHIN Samtec Inc.	350	3.45	- + RFQ		Tape & Reel (TR),Cut Tape (CT)	iCF	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)
NTE436W28 28-PIN DIP IC SOCKET NTE Electronics, Inc	296	3.98	- + RFQ	Datasheet	Bulk	-	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	-	-	-	-	Through Hole	-	Wire Wrap	-	-	-	-	-