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Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
115-83-636-41-003101 CONN IC DIP SOCKET 36POS GOLD Preci-Dip	3,802	2.56	- + RFQ	Datasheet	Bulk	115	Active	DIP, 0.6 (15.24mm) Row Spacing	36 (2 x 18)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICO-316-LTT CONN IC DIP SOCKET 16POS TIN Samtec Inc.	3,789	2.48	- + RFQ	Datasheet	Tube	ICO	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polyester, Glass Filled
116-83-424-41-012101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	3,540	2.56	- + RFQ	Datasheet	Bulk	116	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-012101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	2,331	2.33	- + RFQ	Datasheet	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-002101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3,037	2.56	- + RFQ	Datasheet	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-085-11-001101 CONN SOCKET PGA 85POS GOLD Preci-Dip	2,191	2.56	- + RFQ	Datasheet	Bulk	510	Active	PGA	85 (11 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-085-11-041101 CONN SOCKET PGA 85POS GOLD Preci-Dip	3,842	2.56	- + RFQ	Datasheet	Bulk	510	Active	PGA	85 (11 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-085-11-044101 CONN SOCKET PGA 85POS GOLD Preci-Dip	2,640	2.56	- + RFQ	Datasheet	Bulk	510	Active	PGA	85 (11 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-085-11-045101 CONN SOCKET PGA 85POS GOLD Preci-Dip	3,675	2.56	- + RFQ	Datasheet	Bulk	510	Active	PGA	85 (11 x 11)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-085-10-031101 CONN SOCKET PGA 85POS GOLD Preci-Dip	2,452	2.34	- + RFQ	Datasheet	Bulk	510	Active	PGA	85 (10 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-018101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip	3,234	2.57	- + RFQ	Datasheet	Bulk	116	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-324-41-001101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	2,817	2.34	- + RFQ	Datasheet	Bulk	122	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-424-41-001101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	2,383	2.57	- + RFQ	Datasheet	Bulk	122	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-424-41-001101 CONN IC DIP SOCKET 24POS GOLD Preci-Dip	3,465	2.57	- + RFQ	Datasheet	Bulk	123	Active	DIP, 0.4 (10.16mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-640-41-001101 CONN IC DIP SOCKET 40POS GOLD Preci-Dip	2,175	2.35	- + RFQ	Datasheet	Bulk	614	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-93-422-41-003000 CONN IC DIP SOCKET 22POS GOLD Mill-Max Manufacturing Corp.	2,479	2.50	- + RFQ	Datasheet	Tube	115	Active	DIP, 0.4 (10.16mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
17-0513-10T CONN SOCKET SIP 17POS GOLD Aries Electronics	3,870	2.50	- + RFQ	Datasheet	Bulk	0513	Active	SIP	17 (1 x 17)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
20-1518-10T CONN IC DIP SOCKET 20POS GOLD Aries Electronics	3,912	2.50	- + RFQ	Datasheet	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
22-1518-10 CONN IC DIP SOCKET 22POS GOLD Aries Electronics	3,949	2.50	- + RFQ	Datasheet	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	22 (2 x 11)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
ICF-320-T-O-TR .100 SURFACE MOUNT SCREW MACHIN Samtec Inc.	2,011	2.51	- + RFQ		Tape & Reel (TR)	iCF	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Beryllium Copper	Liquid Crystal Polymer (LCP)