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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-632-41-605101

110-83-632-41-605101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,877 1.90
- +

RFQ

110-83-632-41-605101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-430-41-105101

117-87-430-41-105101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip

2,562 1.90
- +

RFQ

117-87-430-41-105101

Datasheet

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-324-41-036101

146-87-324-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2,176 1.90
- +

RFQ

146-87-324-41-036101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-424-41-035101

146-87-424-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,197 1.90
- +

RFQ

146-87-424-41-035101

Datasheet

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-424-41-036101

146-87-424-41-036101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,454 1.90
- +

RFQ

146-87-424-41-036101

Datasheet

Bulk 146 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-432-31-012101

614-87-432-31-012101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3,682 1.90
- +

RFQ

614-87-432-31-012101

Datasheet

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-632-31-012101

614-87-632-31-012101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2,046 2.04
- +

RFQ

614-87-632-31-012101

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-328-41-001101

614-83-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,183 1.90
- +

RFQ

614-83-328-41-001101

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-007101

116-87-324-41-007101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,776 1.91
- +

RFQ

116-87-324-41-007101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-007101

116-87-424-41-007101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,334 2.09
- +

RFQ

116-87-424-41-007101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-320-41-801101

110-83-320-41-801101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,343 1.91
- +

RFQ

110-83-320-41-801101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-044-08-031101

510-83-044-08-031101

CONN SOCKET PGA 44POS GOLD

Preci-Dip

2,710 1.91
- +

RFQ

510-83-044-08-031101

Datasheet

Bulk 510 Active PGA 44 (8 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-006101

116-83-424-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,520 2.10
- +

RFQ

116-83-424-41-006101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-636-41-001101

110-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,473 2.10
- +

RFQ

110-83-636-41-001101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-422-41-003101

116-83-422-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,805 1.92
- +

RFQ

116-83-422-41-003101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-636-41-105101

110-87-636-41-105101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,607 2.11
- +

RFQ

110-87-636-41-105101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-636-41-001101

614-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,617 2.11
- +

RFQ

614-87-636-41-001101

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-008101

116-87-324-41-008101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,264 2.06
- +

RFQ

116-87-324-41-008101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-012101

116-87-328-41-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,471 1.93
- +

RFQ

116-87-328-41-012101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-628-41-012101

116-87-628-41-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3,562 2.26
- +

RFQ

116-87-628-41-012101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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