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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
4832-6000-CPCONN IC DIP SOCKET 32POS TIN |
3,217 | 0.98 |
RFQ |
Datasheet |
Tube | 4800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
210-43-308-41-001000CONN IC DIP SOCKET 8POS GOLD |
2,501 | 0.98 |
RFQ |
Datasheet |
Tube | 210 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
AR 16-HZL/01-TTCONN IC DIP SOCKET 16POS GOLD |
12,767 | 0.99 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
1-2199300-2CONN IC DIP SOCKET 32POS TINLEAD |
8,291 | 0.99 |
RFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin-Lead | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame, No Center Bar | Solder | 0.100 (2.54mm) | Tin-Lead | 60.0µin (1.52µm) | Brass, Copper | Polyester |
|
4828-6004-CPCONN IC DIP SOCKET 28POS TIN |
2,442 | 1.00 |
RFQ |
Datasheet |
Tube | 4800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
AR 18-HZL-TTCONN IC DIP SOCKET 18POS TIN |
1,470 | 1.00 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
110-44-624-41-001000CONN IC DIP SOCKET 24POS TIN |
5,322 | 1.42 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
A-CCS 028-Z-TCONN SOCKET PLCC 28POS TIN |
1,663 | 1.42 |
RFQ |
Datasheet |
Tube | - | Active | PLCC | 28 (4 x 7) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
110-87-422-41-001101CONN IC DIP SOCKET 22POS GOLD |
2,745 | 1.18 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
AR 28-HZL-TTCONN IC DIP SOCKET 28POS TIN |
7,115 | 1.49 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
110-43-306-41-001000CONN IC DIP SOCKET 6POS GOLD |
1,976 | 1.03 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-44-316-41-001000CONN IC DIP SOCKET 16POS TIN |
2,085 | 1.03 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
4840-6000-CPCONN IC DIP SOCKET 40POS TIN |
6,748 | 1.09 |
RFQ |
Datasheet |
Tube | 4800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
05-0513-10TCONN SOCKET SIP 5POS GOLD |
2,258 | 1.10 |
RFQ |
Datasheet |
Bulk | 0513 | Active | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
A-CCS 020-Z-SMCONN SOCKET PLCC 20POS TIN |
2,359 | 1.11 |
RFQ |
Datasheet |
Tube | - | Active | PLCC | 20 (4 x 5) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyamide (PA9T), Nylon 9T, Glass Filled |
|
210-1-14-003CONN IC DIP SOCKET 14POS GOLD |
107 | 1.17 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
110-87-318-41-001101CONN IC DIP SOCKET 18POS GOLD |
3,627 | 0.97 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
1-2199299-540P,DIP SKT,600 CL,LDR,PB FREE |
7,006 | 1.18 |
RFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Nickel | Polybutylene Terephthalate (PBT), Glass Filled |
|
808-AG11D-ESCONN IC DIP SOCKET 8POS GOLD |
1,527 | 1.19 |
RFQ |
Datasheet |
Tube | 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
A-CCS 044-Z-SMIC SOCKET PLCC 44POS TIN SMD |
18,307 | 1.21 |
RFQ |
Datasheet |
Tube | - | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyamide (PA9T), Nylon 9T, Glass Filled |
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